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October 16, 2008
Renesas Technology Corp.
Fujitsu Limited
Sharp Corporation

NTT DOCOMO, Renesas, Fujitsu, and Sharp to Jointly Develop Platform for HSUPA Mobile Phone

TOKYO, October 16, 2008 — NTT DOCOMO, INC., Renesas Technology Corp., Fujitsu Limited, and Sharp Corporation today announced that they plan to jointly develop the SH-Mobile G4 single-chip LSI device, and a platform incorporating it, to support the HSUPA1/HSDPA2/W-CDMA and GSM/GPRS/EDGE (2G) mobile telephony standards. Development of the platform is targeted for completion by the forth quarter of fiscal 2009 (January–March 2010).

The new SH-Mobile G4 will be fabricated with 45-nm process technology to enable highly integrated functions and extra-fast processing. It will provide enhanced functionality and improved performance for applications handling HD3 video and 3-D graphics. In addition to HSDPA cat.8 for extra-fast downlink speeds (max. 7.2 Mbps), the SH-Mobile G4 will support HSUPA to boost uplink speeds to a maximum of 5.7 Mbps, almost 15 times faster than the conventional 384kbps speeds, thereby enabling much faster bidirectional data transfers.

In 2004 NTT DOCOMO and Renesas began joint development work on the SH-Mobile G series of single-chip LSI devices, which integrate a baseband processor that supports dual-mode communication and an application processor. The SH-Mobile G4 will be the fourth product to emerge from this collaboration.

The joint development work by NTT DOCOMO and Renesas on single-chip LSI devices has since progressed to include handset manufacturers such as Fujitsu and Sharp as partners in the development of mobile phone platforms4. Each platform has a SH-Mobile G series product as the core component and includes a basic software suite (OS, middleware, and drivers) and a reference chipset in a single package. By using the new platforms, mobile phone manufacturers can eliminate the need to develop basic functions independently, significantly reducing development time and costs. This allows them to invest more time and resources in developing distinctive handset features and expanding their product portfolios.

Renesas plans to provide the platform to the worldwide mobile phone market, in addition to customers in Japan.


1. HSUPA: High-Speed Uplink Packet Access. An enhanced and higher-speed version of the 3G W-CDMA uplink (terminal to base station) data communication standard.
2. HSDPA: High-Speed Downlink Packet Access. An enhanced and higher-speed version of the 3G W-CDMA downlink (base station to terminal) data communication standard.
3. HD: High Definition. This term is applied to devices and media that support high-definition imaging.
4. Mobile phone platform: A mobile phone base system that includes hardware, such as a baseband processor for required communication functions, and software.

Note: The names of products, companies, and brands mentioned in this document are the trademarks or registered trademarks of their respective owners.

Block diagram for proposed mobile phone platform:

Press Release

The above information is true and accurate at the time of publication. Manufacture, sale, price and specifications of products may be subject to change.

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