Photocouplers
OPIC Output <DIP type, Gate drive type>

“OPIC” (Optical IC) is a trademark of SHARP Corporation. An OPIC consists of a light-detecting element and signal-processing circuit integrated onto a single chip.

(Ta = 25°C)
Model No.
Internal
connection
diagram
Features
Approved by safety
standards*3
Pac-
kage
Absolute maximum ratings
Electro-optical characteristics
Forward
current
IF
(mA)
Isolation
voltage
(AC)
Viso (rms) (kV)
Propagation delay time
UL
VDE*2
tPHL
(us)
TYP.
tPLH
(us)
TYP.
Vcc
(V)
IF
(mA)
RG
(Ω)
CG
(nF)
PC923LRNSZ0F*1
Built-in drive circuit directly connectable to MOS-FET and IGBT
Peak output current: 1.5 A
Low dissipation current
 (Icc = TYP. 2.5 mA)
High resistance to noise
 (CMR: MIN. 15 kV/s)
8-pin
DIP
25
5.0
MAX.
0.5
MAX.
0.5
15 to 30
7 to 16
47
3
PC925LENSZ0F*1
Built-in drive circuit directly
 connectable to MOS-FET and IGBT
Peak output current: 2.5 A
Low dissipation current
 (Icc = TYP. 2.5 mA)
High resistance to noise
 (CMR: MIN. 15 kV/s)
8-pin
DIP
25
5.0
MAX.
0.5
MAX.
0.5
15 to 30
7 to 16
10
10
*1 Lead forming type is also available for surface mounting. Taped package of lead forming type for surface mounting is also available.
*2 A VDE approved type is optionally available.
*3 Please refer to Specification Sheets for model numbers approved by safety standards.

PC923LRNSZ0F/PC925LENSZ0F
(8-pin DIP)
※Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the EU RoHS Directive*. For details, please contact SHARP.
*EU RoHS Directive: EU legislation restricting the use of lead, cadmium, hexavalent chromium, mercury, specific brominated flame retardants (PBB and PBDE), and phthalates (DEHP, BBP, DBP, DIBP).
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.